MediaTek’s flagship chipsets have gotten more and more widespread for his or her worth proposition. The corporate even managed to outperform Qualcomm by way of market share in This autumn 2023. MediaTek appears to be at the moment engaged on a brand new flagship SoC for Android, termed MediaTek Dimensity 9400, and it has already began gathering the eye of the gang. It’s been stated that it may need the largest die dimension for a smartphone chipset.
MediaTek Dimensity 9400 could have the largest die dimension with over 30 billion transistors
MediaTek is working diligently on its upcoming chipset, and the efforts appear to be seen. In response to stories, the Dimensity 9400 could have a die size measuring dimensions of 150mm², which is even larger than NVIDIA’s GT 1030, which measures 74mm². This offers the chipset the biggest die dimension to this point on a smartphone chipset, and it’s intriguing to say that being a smartphone chipset, it is extremely near a desktop chipset by way of die dimension.
Rising the chipset’s die size is expensive, nevertheless it does have its personal set of benefits. For instance, the chipset can accommodate extra transistors, a better cache, and an even bigger neural processing unit.
The Dimensity 9400, owing to the bigger die dimension, could have over 30 billion transistors. That is 32% larger than the entire of twenty-two.7 billion transistors discovered on the Dimensity 9300.
A Greater die dimension might trigger overheating and different points
Nicely, having an even bigger die dimension for a chipset isn’t all rosy for the MediaTek Dimensity 9400. It could actually add a number of extra manufacturing-related prices to the chipset, which may find yourself giving it the title of MediaTek’s costliest smartphone chip. On high of this, it’ll construct it on a TSMC 3nm fabrication course of, and subsequently, anticipating the chip to be cheaper could be fully pointless.
So as to add additional, there have been stories that the Dimensity 9400 might warmth up because it prioritizes the uncooked efficiency cores over ARM’s energy effectivity cores. That is normally the case with nearly all the chipsets having higher-clocked CPUs. It’s probably not the die dimension in charge. The heating could possibly be because of the ARM’s Cortex X5 CPU and we should always not draw any closing conclusion earlier than the industrial launch of the chipset.
